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| HIGH NOISE REDUCTION HIGH SPEED ANALOG OUTPUT 5 PIN SOP OPTOCOUPLER FEATURES * HIGH COMMON MODE TRANSISENT IMMUNITY: CMH,CML: 10 kV/s MIN * HIGH ISOLATION VOLTAGE: BV: 2500 Vr.m.s. * HIGH SUPPLY VOLTAGE: VCC = 35 V * HIGH SPEED RESPONSE: tPHL = 0.8 s MAX, tPLH = 1.2 s MAX * AVAILABLE IN TAPE AND REEL: PS8701-E3, E4, F3, F4 ESD SENSITIVE PS8701 DESCRIPTION The PS8701 is an optically coupled isolator containing a GaAIAs LED on the light emitting diode (input) side and a PIN photodiode and a high speed amplifier transistor on the output side on one chip. Its small package makes it ideal for high density circuits and applications. APPLICATIONS * COMPUTERS AND PERIPHERALS * GENERAL PURPOSE INVERTER * POWER SUPPLIES * RELAY AND PULSE TRANSFORMER REPLACEMENTS ELECTRICAL CHARACTERISTICS (TA = 25C) PART NUMBER SYMBOLS VF PARAMETERS Forward Voltage, IF = 16 mA Reverse Current, VR = 3 V Forward Voltage Temp. Coefficient, IF = 16 mA Terminal Capacitance, V = 0 V, f = 1.0 MHz High Level Output Current IF = 0 mA, VCC = VO = 5.5 V High Level Output Current IF = 0 mA, VCC = VO = 30 V Low Level Output Voltage IF = 16 mA, VCC = 4.5 V, LO = 1.2 mA Low Level Supply Current IF = 16 mA, VO = Open, VCC = 30 V High Level Supply Current IF = 0 mA, VO = Open, VCC = 30 V Current Transfer Ratio, IF= 16 mA, VCC = 4.5 V, VO = 0.4 V Isolation Resistance, V IN-OUT = 1k VDC, RH = 40 to 60 % Isolation Capacitance, V = 0, f = 1.0 MHz Propagation Delay Time, (High Low)1 IF = 16 mA, VCC = 5 V, RL = 2.2 k , CL = 15 pF Propagation Delay Time, (Low High)1 IF= 16 mA, VCC = 5 V, RL = 2.2 k , CL = 15 pF Common Mode Transient Immunity at High Level Output2 IF= 0 mA, VCC = 5 V, RL = 4.1 k , VCM = 1.5 kV Common Mode Transient Immunity at Low Level Output 2 IF= 16 mA, VCC = 5 V, RL = 4.1 k , VCM = 1.5 kV UNITS V A mV/C pF nA A V A A % pF s s kV/s kV/s 10 -10 Pin Connection (Top View) 5 4 3 PS8701 MIN TYP 1.7 -1.6 60 3 500 100 0.1 50 0.01 15 10 11 MAX 2.2 10 Diode IR VF/T Ct IOH(1) IOH(2) Detector VOL ICCL ICCH CTR RI-O CI-O tPHL 0.4 2 35 20 0.4 0.5 0.6 0.8 1.2 Coupled tPLH CMH CML PLEASE SEE NOTES ON NEXT PAGE. 1 2 California Eastern Laboratories PS8701 ABSOLUTE MAXIMUM RATINGS1 (TA = 25C) SYMBOLS Diode IF VR PD Detector VCC VO IO PC Coupled BV TA TSTG PARAMETERS UNITS RATING 4.5 MAX OUTLINE DIMENSIONS (Units in mm) PS8701 (Top View) 5 4 3 Forward Current Reverse Voltage Power Dissipation Supply Voltage Output Voltage Output Current Power Dissipation Isolation Voltage2 Operating Ambient Temp. Storage Temperature mA V mW V V mA mW Vr.m.s. C C 25 3.0 45 35 35 8.0 100 2500 -55 to +100 -55 to +125 2.3 MAX +0.10 -0.05 1. 2. 3. 4. 5. 1 2 Anode Cathode GND VO VCC 7.00.3 4.4 0.15 1.3 0.10.1 1.27 0.4 1.2 MAX +0.10 -0.05 0.50.3 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. AC voltage for one minute at TA = 25C, RH = 60% between input and output. 0.25 M (Continued from previous pags) NOTES: 1. Test Circuit for Propagation Delay Time: VCC = 5 V Pulse input (Pulse width = 100 s Duty Cycle = 1/10) Input 50% 0.1 F RL = 2.2 k VO (monitor) CL = 15 pF * Output 5V Input (monitor) 47 tPHL tPLH 1.5V VOL *CL is approximately 15 pF which includes probe and stray wiring capacitance. 2. Test Circuit forCommon Mode Transient Immunity: IF VCC = 5 V 0.1 F RL = 4.1 k VO (monitor) VCM 90% 10% tr tf 1.5 kV 0V VO (IF = 0 mA) VO (IF = 16 mA) 5V 2V 0.8 V VOL VCM Usage Cautions: 1. When handling this product, precautions should be taken against static electricity. 2. A by-pass capacitor of 0.1 F is used between VCC and GND. PS8701 TYPICAL PERFORMANCE CURVES (TA = 25 C) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE 50 120 TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation, PC (mW) 25 50 75 100 Diode Power Dissipation, PD (mW) 40 100 80 30 60 20 40 10 20 0 0 25 50 75 100 Ambient Temperature, TA (C) Ambient Temperature, TA (C) FORWARD CURRENT vs. FORWARD VOLTAGE 100 1000 HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE Forward Current, IF (mA) 10 TA = +100 C +50 C +25 C 0 C -25 C High Level Output Current, IOH (nA) IF = 0 mA 100 VCC = VO = 30 V VCC = VO = 5.5 V 1 10 0.1 1 0.01 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.1 -25 0 25 50 75 100 Forward Voltage, VF (V) Ambient Temperature, TA (C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT VCC = 4.5 V VO = 0.4 V NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE Normalized Current Transfer Ratio, CTR 80 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 Normalized to 1.0 at TA = 25 C, IF = 16 mA VCC = 4.5 V, VO = 0.4 V Current Transfer Ratio, CTR ( %) 70 60 50 40 30 20 10 0 0.5 1 5 10 50 -25 0 25 50 75 100 Forward Current, IF (mA) Ambient Temperature, TA (C) PS8701 TYPICAL PERFORMANCE CURVES (TA = 25 C) OUTPUT CURRENT vs. OUTPUT VOLTAGE 10 OUTPUT VOLTAGE vs. FORWARD CURRENT 6 Output Current, IO (mA) 8 IF = 25 mA 6 20 mA 15 mA 4 10 mA 2 5 Output Voltage, VO (V) 4 3 RL = 2.2 k 2 5 mA 1 5.6 k 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20 Output Voltage, VO (V) Forward Current, IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT 3.0 10 PROPAGATION DELAY TIME vs. LOAD RESISTANCE VCC = 5 V, IF = 16 mA Propagation Delay Time, tPLH (s) Propagation Delay Time, tPLH (s) VCC = 5 V RL = 2.2 k 2.0 tPLH 1 tPHL 1.0 tPHL tPLH 0 5 10 15 20 25 0.1 1k 10 k 100 k Forward Current, IF (mA) Load Resistance, RL () Normalized Propagation Delay Time, tPHL (tPLH) NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 5 Normalized to 1.0 at TA = 25 C, IF = 16 mA, VCC = 5 V, RL = 2.2 k 4 3 2 tPLH tPHL 1 0 -50 -25 0 25 50 75 100 Ambient Temperature, TA (C) PS8701 TAPING SPECIFICATIONS (Units in mm) OUTLINE AND DIMENSIONS (TAPE) 2.0 0.1 4.0 0.1 1.75 0.1 1.55 0.1 2.4 0.1 OUTLINE AND DIMENSIONS (REEL) 1.5 0.1 1.5 0.1 12 21.0 0.8 0 5.5 0.1 PS8701-E3, E4: 178 PS8701-F3, F4: 330 12.0 0.2 1.5 0.5 0.3 1.55 0.1 4.6 0.1 8.0 0.1 60 6.0 1 66 7.4 0.1 2.0 0.5 13.00.5 12.4 -0.0 +2.0 18.4 MAX Notes: 1. Packing : PS8701-E3, E4 900 pcs/reel PS8701-F3, F4 3500 pcs/reel TAPE DIRECTION PS8701-E3 PS8701-F3 PS8701-E4 PS8701-F4 PS8701 RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering * * * * Peak reflow temperature Time of temperature higher than 210 C Number of reflows Flux 235 C (package surface temperature) 30 seconds or less Three Rosin flux containing small amount of chlorine (The flux with a max. chlorine content of 0.2 Wt % is recommended Package Surface Temperature T (C) (heating) to 10 s 235 C (peak temperature) 210 C to 30 s 120 to 160 C 60 to 90 s (preheating) Time (s) Caution: Please avoid removing the residual flux by water after the first reflow process. Peak temperature 235 C or below (2) Dip soldering * * * * Temperature Time Number of times Flux 260 C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a max. chlorine content of 0.2 Wt % is recommended.) Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES * Headquarters * 4590 Patrick Henry Drive * Santa Clara, CA 95054-1817 * (408) 988-3500 * Telex 34-6393 * FAX (408) 988-0279 Internet: http://WWW.CEL.COM DATA SUBJECT TO CHANGE WITHOUT NOTICE 10/10/2001 |
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